Murata Manufacturing Co., Ltd. (“Murata” below) has developed and mass-produced the compact wireless module LBEE5KL1YN (“Type 1YN” below) with a built-in Wi-Fi™/Bluetooth®/Bluetooth Low Energy combo chip CYW43439 of Infineon Technologies AG (“Infineon” below). Murata has also released the compact wireless module LBEE5PK2AE (“Type 2AE” below) with a built-in Wi-Fi/Bluetooth/Bluetooth Low Energy combo chip CYW4373E of Infineon.

Following the recent years of rapid growth in the IoT market, installation of wireless communication functions on IoT devices and industrial equipment has become necessary.　Compact and high-performance communication modules are required for IoT devices and compact, high-performance, and wide temperature range communication modules are required for industrial equipment.

This product achieves a compact, high-performance, and shielded structure through Murata’s unique wireless design technologies, space saving implementation technologies, and product processing technologies. While being compact, the Type 1YN achieves high speed communications while supporting Wi-Fi 4*1 and Bluetooth 5.2. The Type 2AE has high temperature capabilities while supporting Wi-Fi 5*2 and Bluetooth 5.2. With the hardware mechanism and algorithm, simultaneous use of both Wi-Fi and Bluetooth is available, optimizing both their performances. Furthermore, as control interfaces, they support PCM for audio data communications. Both are optimal for the IoT market, which requires compact, high-performance, and low noise products, as well as for applications in handheld wireless systems, gateways, and industrial equipment.
Furthermore, the modules comply to the Japanese and U.S. Radio Laws, contributing to the early stages of our customers’ product development.